dicing

英 [ˈdaɪsɪŋ]

美 [ˈdaɪsɪŋ]

v.  将(肉、菜等)切成小方块; 将…切成丁
dice的现在分词

计算机

柯林斯词典

• 骰子;色子
  Adiceis a small cube which has between one and six spots or numbers on its sides, and which is used in games to provide random numbers. In old-fashioned English, 'dice' was used only as a plural form, and the singular wasdie, but now 'dice' is used as both the singular and the plural form.
• 掷骰子游戏
  Diceis a game which is played using dice.
• VERB 把(食物)切成小块;将…切丁
  If youdicefood, you cut it into small cubes.
  1. Dice the onion...
     把洋葱切成丁。
  2. Add the crushed garlic and remaining diced vegetables.
     加入捣碎的大蒜和剩余的蔬菜丁。

双语例句

• Development of Conductive Photopolymer Resin Bond Dicing Blade
  导电性光固化树脂结合剂锯片的研制
• After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward.
  通过对半导体加工工艺的分析研究，提出了用磨料水射流切割半导体材料，包括晶圆的切割、芯片的终端封装切割。
• Just like tags for requirements, categories of your test cases can be invaluable for slicing and dicing your testing data so that you can determine what's really happening.
  就像对于需求的标签一样，测试用例的范畴对于切割测试数据以便决定到底发生了什么来说是无价的。
• Alphablox provides drill-down and slicing and dicing capabilities that can answer the types of business questions that we asked earlier.
  Alphablox提供向下钻取和细分功能，以回答我们先前提出的业务问题。
• The system functions mainly include macro dicing, micro planning and district demolition.
  该系统主要有学校宏观划片、微观规划和片区拆迁等功能。
• The Experimental Research of Sapphire Dicing by a UV Laser
  紫外激光划切蓝宝石晶圆的试验研究
• Introduces the development of semiconductor industry, the characteristic of laser wafer dicing technology, the structure of laser wafer dicing machine, and the application in the production.
  介绍了半导体行业的发展，晶圆激光划片技术的特点、激光划片系统的组成与其在实际过程中应用。
• You're dicing with death by driving that car so fast.
  你把车开得那么快简直在找死。
• A lady doesn't crawl around on the decks dicing with the crew.
  高贵女士可不会和船员们在船的甲板上来回爬。
• In this paper, part of theoretical and experimental studies on the application of UV laser in dicing of sapphire wafer and SiC were presented.
  本论文对紫外激光应用于蓝宝石晶圆和碳化硅等材料的划切加工技术进行了部分理论与试验研究工作。